Semiconductor Packaging Solution Provider
A MEMS Low Cost package development resource provider for companies bringing MEMS products to market.
To support MEMS & specialty Semi/MEMS fabless and IDM’s
Provide molded Air Cavity Packages, LGA Cavity, Over-molded packages, & MEMS SIP
Support engineering & proto-typing to production services
To support MEMS & specialty Semi/MEMS fabless and IDM’s
Provide molded Air Cavity Packages, LGA Cavity, Over-molded packages, & MEMS SIP
Support engineering & proto-typing to production services
Open Tool Offering
QFN & LGA Air-Cavity
Custom LCP Microphoney
Overmold QFN
MEMS Stack-Die
Customize Packaging
SOIC Cavity
FBGA/LGA SIP Modules
Gesture Proximity Sensor Package
Enhanced QFN RF Shield Exposed Seal Ring
Solutions
Molding
MEMS Medical & Gas Sensor
MAF Auto Module
Will Custom Design
To Fit Customer Needs(Available)
To Fit Customer Needs(Available)